Principal Engineer, Process Engineering (PEALD SiN)

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company.

Job's mission

As an R&D Principal Engineer, Process Engineering at ASM, you will play a key role in developing and optimizing advanced semiconductor deposition processes that enable next-generation devices.
You will work hands-on with state-of-the-art processing and analytical equipment, contributing to innovation in ALD/PEALD, PECVD, CVD, Epitaxy, oxidation, annealing, and curing processes.
This role offers the opportunity to turn scientific ideas into impactful technologies through process development, customer engagement, and intellectual property creation.

What you will be working on

Researching, developing, and optimizing thin film deposition processes, with a focus on metal and dielectric films using PEALD and related technologies.

Designing and executing complex experiments using Design of Experiments (DOE) and Response Surface Methodology (RSM), and interpreting experimental results.

Developing new film materials and processes for emerging semiconductor applications based on strong chemistry and materials science fundamentals.

Actively troubleshooting process and equipment issues through hands-on engagement.

Participating in and driving structured technical problem-solving using scientific methodologies and industry tools.

Collaborating with customers and central marketing to define requirements and execute customer demonstrations.

Supporting product transfer to customers by delivering demonstrations, training field service teams, creating technical documentation, and traveling to customer sites (up to 10%).

Authoring technical papers and contributing to intellectual property (IP) generation related to process and technology development.

What we are looking for

PhD with 10+ years or MS degree with 14+ years of relevant industry experience in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field.

Hands-on experience with PEALD, ALD, PECVD, CVD, Epitaxy, or other thin film deposition technologies.

Strong understanding of thin film deposition principles and semiconductor process development.

Experience designing and characterizing deposition processes using first principles and experimental design techniques.

Ability to independently manage complex process development activities.

Excellent communication skills in English and Korean, with the ability to clearly explain complex technical concepts.

What sets you apart

Knowledge of electrical characterization techniques for CMOS devices.

Experience integrating metal and/or dielectric films into FEOL and BEOL process flows.

Hands-on experience with materials characterization techniques such as XPS, SIMS, AFM, XRD, TEM, SEM, Raman, or ellipsometry.

Experience authoring technical publications and/or patents in the semiconductor industry.

Strong collaboration skills with customers, field teams, and cross-functional stakeholders.