Engineer - 6G RF Packaging

Huawei Canada has an immediate permanent opening for an Engineer.

About the team:
Welcome to the Advanced Wireless Technology Wireless Lab, an epitome of innovation located in Ottawa, Canada. Here, amid the dynamic panorama of technological progress, our team consists mainly of seasoned graduate computer engineers and computer scientists. With diverse experiences ranging from fresh perspectives to decades-long industry immersion, we are united by our fervour for pioneering wireless solutions.

About the job:

• Explore 2.5D/3D integration, wafer-level packaging, diverse interposers, and embedded passives.
• Study low-loss die-to-die and die-to-package interfaces, including micro-bumps, vias, and waveguide structures.
• Develop embedded shielding, isolation structures, and localized cooling for high-power RF arrays.
• Investigate additively manufactured RF structures and engineered materials for prototyping advantages.
• Perform full-wave EM simulations to quantify interconnect loss, leakage, coupling, and noise.
• Design package transitions, antenna feeds, and grounding networks across die, substrate, and board boundaries.
• Coordinate VNA, thermal, and OTA array measurements to evaluate system-level package performance.
• Partner with internal specialists (RFIC, antenna, materials, manufacturing) to frame cross-disciplinary research.
• Secure patents and invention disclosures while publishing papers and internal technical reports.

The total target annual compensation for this position ranges from $106,000 to $156,000 depending on education, experience, and demonstrated expertise.

About the ideal candidate:

• 5 years of relevant industry experiences.
• PhD in Electrical Engineering, RF/Microwave Engineering, Packaging, or a related field (or equivalent advanced R&D experience).
• Deep knowledge of RF/microwave principles.
• Experience using full-wave EM and circuit simulation tools to model packages and correlate results with measure.
• Hands-on experience designing test vehicles and directing microelectronics assembly (e.g., PCB, flip-chip, wire bonding, SMT, molding).
• Proficiency with RF lab equipment (VNAs), probe station.
• Working knowledge of thermal management, CTE mismatch, stress, warpage, and reliability testing.