Director of Package Design
- Salary
- $142,800 - $274,800 per year
- Level
- Lead
- Work type
- On-site · California
Not stated in the posting: visa.
Open. First seen 26 October 2026.
About the role
Overview Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational…
What this role asks for
Particular to this role
PCB Design
Rare in Microsoft's other 93 open postings.
Compared with Microsoft's other open jobs.
The team: Silicon Engineering NEW TEAM
This team is new: its 14 open roles were posted Oct 13–20, and Microsoft had none in it before. You would be one of its first people.
WHAT THE TEAM WORKS WITH, ACROSS ITS POSTINGS
Azure (14 of 14), Microsoft 365 (14 of 14), Python (8 of 14), C++ (6 of 14), C (5 of 14), Perl (5 of 14), Verilog (5 of 14)
OTHER ROLES ON THIS TEAM
- Principal Physical Design Engineer posted Oct 20
- Senior Physical Design Engineer posted Oct 20
- Principal Silicon Design Verification Engineer posted Oct 20
- Senior Silicon Engineer posted Oct 20
- Principal Design Verification Engineer posted Oct 20
- Principal Silicon Design Verification Engineer posted Oct 20
- Principal SOC Performance Verification Engineer posted Oct 14
- Senior Software CAD DevOps Engineer posted Oct 13
- Senior FPGA/Silicon Design Engineer posted Oct 13
- Principal Design Verification Engineer posted Oct 13
- Senior Silicon CAD Software Engineer posted Oct 13
- Test Engineer (Silicon Engineering) posted Oct 13
- Senior AI Silicon Infrastructure Engineer posted Oct 13
From the team and dates on Microsoft's own job board.
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