FY27 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship - ASIC Design / Verification/Implementation - Canada (12 or 16 months)
- Salary
- $54,600 - $103,350
- Level
- Intern
- Work type
- On-site · Markham
Not stated in the posting: visa.
Open. First seen 26 October 2026.
About the role
Company: Qualcomm Canada ULC Job Area: Interns Group, Interns Group > Interim Engineering Intern - HW Qualcomm Overview: Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform…
What this role asks for
Particular to this role
Bluetooth · FPGA · Verilog
Rare in Qualcomm's other 299 open postings.
Standard for embedded / hardware roles
C++ · Embedded Systems
Common in embedded / hardware postings at any company.
In most of Qualcomm's ads
Python
Named in most of its open postings, whatever the role.
Compared with Qualcomm's other open jobs.
The team: Interim Engineering Intern - HW
This role is one of 8 open in Interim Engineering Intern - HW.
WHAT THE TEAM WORKS WITH, ACROSS ITS POSTINGS
Python (8 of 8), C (7 of 8), C++ (7 of 8), FPGA (4 of 8), Perl (4 of 8), Verilog (4 of 8), LLM (3 of 8)
OTHER ROLES ON THIS TEAM
- FY27 Intern - Silicon Validation Internship - Canada (16 months) posted Sep 17
- FY27 Intern - Display IP Engineering Internship - Canada (16 months) posted Sep 17
- FY27 Intern - Compute DSP/AI Processor Engineering Internship - Canada (16 months) posted Sep 17
- FY27 Intern - Physical Mixed Layout Engineering Internship - Canada (16 months) posted Sep 17
- FY27 Intern - MSIP Design Methodology Engineering Internship - Canada (16 months) posted Sep 17
- FY27 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship - ASIC Firmware / Embedded - Canada (12 or 16 months) posted Sep 17
- Intern- AI Integration & Interoperability posted Apr 20
From the team and dates on Qualcomm's own job board.
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