Principal Thermal Engineer
- Salary
- $210,000 - $315,000
- Level
- Principal
- Work type
- On-site · San Diego
Not stated in the posting: visa.
Open. First seen 27 October 2026.
About the role
Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: Qualcomm is driving the next generation of AI computing, delivering breakthrough technologies that power intelligent experiences from edge devices to the…
What this role asks for
Particular to this role
ANSYS · MATLAB
Rare in Qualcomm's other 299 open postings.
In most of Qualcomm's ads
Python
Named in most of its open postings, whatever the role.
Compared with Qualcomm's other open jobs.
The team: Packaging Engineering HIRES STEADILY
This role is one of 7 open in Packaging Engineering. 3 were posted in the last 30 days and the oldest in July: a team that hires all year rather than one being built.
WHAT THE TEAM WORKS WITH, ACROSS ITS POSTINGS
Python (5 of 7), C (4 of 7), C++ (4 of 7), PCB Design (4 of 7), ANSYS (3 of 7), MATLAB (3 of 7), Perl (2 of 7)
OTHER ROLES ON THIS TEAM
- Central Hardware Systems – EE Automation Engineer, up to Sr. posted Oct 8
- Staff Engineer, Thermal posted Oct 5
- Packaging SIPI Engineer, Sr. Staff posted Sep 17
- RF Electromagnetic (EM) Engineer - San Diego posted Sep 17
- Senior Engineer - IC Package Design posted Jul 31
- 【Welcome New Grads】Package/System Design Solutions Engineer - Engineer / Sr. Engineer posted Jul 26
From the team and dates on Qualcomm's own job board.
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