Qualcomm

Engineering Director - AI/Wireless Module Design

Shanghai, China
Level
Lead
Work type
On-site · Shanghai

Not stated in the posting: salary, visa.

Open. First seen 6 November 2026.

Apply on careers.qualcomm.com →

About the role

Company: Qualcomm China Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: The QC module design team is looking for a candidate in a leadership role, who will lead a team of engineers consisting of RF design engineers, baseband design…

Read the full posting on careers.qualcomm.com

The team: Hardware Engineering HIRES STEADILY

This role is one of 308 open in Hardware Engineering. 78 were posted in the last 30 days and the oldest in October: a team that hires all year rather than one being built.

WHAT THE TEAM WORKS WITH, ACROSS ITS POSTINGS

FPGA (157 of 308), Python (149 of 308), Perl (109 of 308), C++ (76 of 308), Verilog (71 of 308), C (55 of 308), Embedded Systems (50 of 308)

OTHER ROLES ON THIS TEAM

From the team and dates on Qualcomm's own job board.

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