FY27 Intern - QDSP Hardware Physical Design Internship - Canada (12 or 16 months)
- Salary
- $54,600 - $103,350
- Level
- Intern
- Work type
- On-site · Markham
Not stated in the posting: visa.
Open. First seen 1 November 2026.
About the role
Company: Qualcomm Canada ULC Job Area: Interns Group, Interns Group > Interim Engineering Intern - HW Qualcomm Overview: Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform…
What this role asks for
Standard for embedded / hardware roles
C++ · Python
Common in embedded / hardware postings at any company.
Compared with Qualcomm's other open jobs.
The team: Interim Engineering Intern - HW HIRES STEADILY
This role is one of 18 open in Interim Engineering Intern - HW. 4 were posted in the last 30 days and the oldest in April: a team that hires all year rather than one being built.
WHAT THE TEAM WORKS WITH, ACROSS ITS POSTINGS
Python (17 of 18), C (15 of 18), C++ (15 of 18), Perl (12 of 18), Verilog (11 of 18), Embedded Systems (7 of 18), Linux (6 of 18)
OTHER ROLES ON THIS TEAM
- FY27 Intern - High-Speed Electrical and Optical Systems Validation Co-Op - Canada (4 months) posted Oct 30
- FY27 Intern - Camera Design Engineering Internship - Canada (12 or 16 months) posted Oct 28
- FY27 Intern - AI and DSP Applications Engineering Internship - Canada (16 months) posted Oct 22
- Mechanical Engineering Internship – Summer 2027 posted Sep 18
- RF/Analog Design/Mixed-Signal Engineering Internship – Summer 2027 posted Sep 18
- Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027 posted Sep 18
- FY27 Intern - MSIP Digital Design Verification Engineering Internship - Canada (16 months) posted Sep 18
- FY27 Intern - IP Applications Engineering Internship - Canada (16 months) posted Sep 18
- FY27 Intern - MSIP Digital Design Engineering Internship - Canada (16 months) posted Sep 18
- FY27 Intern - Display IP Engineering Internship - Canada (16 months) posted Sep 17
- FY27 Intern - Compute DSP/AI Processor Engineering Internship - Canada (16 months) posted Sep 17
- FY27 Intern - MSIP Design Methodology Engineering Internship - Canada (16 months) posted Sep 17
- FY27 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship - ASIC Design / Verification/Implementation - Canada (12 or 16 months) posted Sep 17
- FY27 Intern - Silicon Validation Internship - Canada (16 months) posted Sep 17
- FY27 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship - ASIC Firmware / Embedded - Canada (12 or 16 months) posted Sep 17
- Interim Engineering Intern_2027_HW posted Sep 9
- Intern- AI Integration & Interoperability posted Apr 20
From the team and dates on Qualcomm's own job board.
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