Packaging SIPI Engineer, Sr. Staff
- Salary
- $191,800 - $287,800
- Level
- Staff
- Work type
- On-site · San Diego
Not stated in the posting: visa.
Open. First seen 28 October 2026.
About the role
Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: The Qualcomm Package Electrical Team has an opening in the areas of signal integrity and power integrity. The candidate will work with package and IC…
What this role asks for
Particular to this role
MATLAB · PCB Design
Rare in Qualcomm's other 299 open postings.
In most of Qualcomm's ads
Python
Named in most of its open postings, whatever the role.
Compared with Qualcomm's other open jobs.
The team: Packaging Engineering HIRES STEADILY
This role is one of 22 open in Packaging Engineering. 9 were posted in the last 30 days and the oldest in July: a team that hires all year rather than one being built.
WHAT THE TEAM WORKS WITH, ACROSS ITS POSTINGS
PCB Design (13 of 22), Python (10 of 22), ANSYS (8 of 22), C (8 of 22), C++ (8 of 22), MATLAB (8 of 22), Perl (4 of 22)
OTHER ROLES ON THIS TEAM
- Principal Thermal Engineer posted Oct 26
- Staff IC Packaging Engineer - Mechanical Simulation posted Oct 20
- Senior SI/PI Engineer (High-Speed Systems) posted Oct 14
- Signal and Power Integrity Engineer, Senior to Staff Level posted Oct 14
- Senior Leader, Signal and Power Integrity/Systems Architecture (High-Speed Interconnects) - Multiple locations posted Oct 13
- RF Package Design Engineer, Senior Staff posted Oct 13
- Central Hardware Systems – EE Automation Engineer, up to Sr. posted Oct 8
- Staff Engineer, Thermal posted Oct 5
- Sr. Staff Packaging Engineer- Process Package Integrity & Bumping posted Sep 25
- Package Design Engineer - Staff posted Sep 17
- Principal IC Packaging Engineer posted Sep 17
- Sr Staff or Principal Thermal Engineer, Server Packaging (San Diego) posted Sep 17
- Voltage Regulator (VR) Architect posted Sep 17
- Packaging SIPI Engineer, Sr. Staff posted Sep 17
- RF Electromagnetic (EM) Engineer - San Diego posted Sep 17
- Director, IC Packaging Engineering – Mechanical Simulation posted Sep 17
- IC Package Design Engineer, Staff posted Sep 8
- Thermal Engineer, Staff posted Aug 20
- Senior Engineer - IC Package Design posted Jul 31
- 【Welcome New Grads】Package/System Design Solutions Engineer - Engineer / Sr. Engineer posted Jul 26
- IC Package Layout Engineer, Staff posted Jul 6
From the team and dates on Qualcomm's own job board.
Other openings for this role
2 open postings for this role in San Diego, California, United States of America, first posted 26 October 2026. The company is likely hiring for more than one position. None has been taken down and posted again.
- 28 October 2026 – open (this posting)
- 26 October 2026 – open
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