FY27 Intern - Digital Design Engineering Internship - Canada (16 months)
- Salary
- $54,600 - $103,350
- Level
- Intern
- Work type
- On-site · Toronto
Not stated in the posting: visa.
Open. First seen 4 November 2026.
About the role
Company: Qualcomm Canada ULC Job Area: Interns Group, Interns Group > Interim Engineering Intern - HW Qualcomm Overview: Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform…
What this role asks for
Particular to this role
FPGA · Verilog
Rare in Qualcomm's other 299 open postings.
Compared with Qualcomm's other open jobs.
The team: Interim Engineering Intern - HW HIRES STEADILY
This role is one of 22 open in Interim Engineering Intern - HW. 8 were posted in the last 30 days and the oldest in April: a team that hires all year rather than one being built.
WHAT THE TEAM WORKS WITH, ACROSS ITS POSTINGS
Python (21 of 22), C (19 of 22), C++ (19 of 22), Verilog (15 of 22), Perl (13 of 22), Embedded Systems (8 of 22), Machine Learning (7 of 22)
OTHER ROLES ON THIS TEAM
- FY27 Intern - Design Verification Engineering Internship - Canada (16 months) posted Nov 2
- FY27 Intern - Qualcomm SoC Engineering Internship - Canada (16 months) posted Nov 2
- FY27 Intern - Camera HW ASIC Verification Intern - Canada (12 or 16 months) posted Oct 30
- FY27 Intern - High-Speed Electrical and Optical Systems Validation Co-Op - Canada (4 months) posted Oct 30
- FY27 Intern - Camera Design Engineering Internship - Canada (12 or 16 months) posted Oct 28
- FY27 Intern - AI and DSP Applications Engineering Internship - Canada (16 months) posted Oct 22
- FY27 Intern - QDSP Hardware Physical Design Internship - Canada (12 or 16 months) posted Oct 19
- Mechanical Engineering Internship – Summer 2027 posted Sep 18
- RF/Analog Design/Mixed-Signal Engineering Internship – Summer 2027 posted Sep 18
- Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027 posted Sep 18
- FY27 Intern - MSIP Digital Design Verification Engineering Internship - Canada (16 months) posted Sep 18
- FY27 Intern - IP Applications Engineering Internship - Canada (16 months) posted Sep 18
- FY27 Intern - MSIP Digital Design Engineering Internship - Canada (16 months) posted Sep 18
- FY27 Intern - Display IP Engineering Internship - Canada (16 months) posted Sep 17
- FY27 Intern - Compute DSP/AI Processor Engineering Internship - Canada (16 months) posted Sep 17
- FY27 Intern - MSIP Design Methodology Engineering Internship - Canada (16 months) posted Sep 17
- FY27 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship - ASIC Design / Verification/Implementation - Canada (12 or 16 months) posted Sep 17
- FY27 Intern - Silicon Validation Internship - Canada (16 months) posted Sep 17
- FY27 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship - ASIC Firmware / Embedded - Canada (12 or 16 months) posted Sep 17
- Interim Engineering Intern_2027_HW posted Sep 9
- Intern- AI Integration & Interoperability posted Apr 20
From the team and dates on Qualcomm's own job board.
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